Handheld device enclosure

ABSTRACT

This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation patent application of U.S. patentapplication Ser. No. 17/525,614, filed Nov. 12, 2021 and titled“Handheld Device Enclosure,” which is a continuation patent applicationof U.S. patent application Ser. No. 16/994,299, filed Aug. 14, 2020 andtitled “Handheld Device Enclosure Having an Outer Periphery Member andFront and Rear Cover Assemblies,” now U.S. Pat. No. 11,194,362, which isa continuation patent application of U.S. patent application Ser. No.16/405,239, filed May 7, 2019 and titled “Handheld Device Enclosure,”now U.S. Pat. No. 10,754,388, which is a continuation patent applicationof U.S. patent application Ser. No. 15/892,310, filed Feb. 8, 2018 andtitled “Handheld Device Enclosure Having Outer Periphery Members and aFront Cover Assembly,” now U.S. Pat. No. 10,303,219, which is acontinuation patent application of U.S. patent application Ser. No.15/168,194, May 30, 2016 and titled “Handheld Device Enclosure,” nowU.S. Pat. No. 9,898,049, which is a continuation patent application ofU.S. patent application Ser. No. 14/064,785, filed Oct. 28, 2013 andtitled “Handheld Device Enclosure,” now U.S. Pat. No. 9,357,665, whichis a continuation patent application of U.S. patent application Ser. No.12/794,529, filed Jun. 4, 2010 and titled “Handheld Device Enclosure,”now U.S. Pat. No. 8,576,561, which claims the benefit of U.S.Provisional Patent Application No. 61/300,780, filed Feb. 2, 2010 andtitled “Handheld Device Enclosure,” U.S. Provisional Patent ApplicationNo. 61/325,625, filed Apr. 19, 2010 and titled “Electrically InsulatingConnection Between Conductive Components,” and U.S. Provisional PatentApplication No. 61/325,786, filed Apr. 19, 2010 and titled “CosmeticCo-Grinding of Electronic Device Surfaces,” the disclosures of which arehereby incorporated herein by reference in their entireties.

BACKGROUND

A portable electronic device can be constructed using any suitableapproach. For example, a “bucket” type approach can be used in which afirst housing component serves as a bucket into which electronic devicecomponents are placed, and a second housing component serves as a coverfor the bucket. This arrangement secures the electronic devicecomponents between the first and second housing components. As avariation of this, some or all of the electronic device components canbe assembled into the cover for the bucket, and the cover cansubsequently be rotated into the bucket to close the device.

Other known portable electronic devices can be constructed by insertingcomponents into a hollow housing element. For example, an electronicdevice can be constructed using a tubular structure (e.g., a flattenedtube or a hollow rectangular tube) into which electronic devicecomponents can be inserted. The electronic device components can beinserted into the tubular structure from one or both ends, and connectedwithin the structure. For example, one or more circuits inserted fromopposite ends of the tubular structure can be connected through anopening for a window in the structure. The structure can be capped atone or both ends to ensure that the components remain fixed within thetubular structure, and to provide interface components (e.g.,connectors, buttons, or ports) for the device.

SUMMARY

This is directed to an electronic device including an outer peripherymember that forms the sides of the electronic device. The outerperiphery member can define a volume into which electronic devicecomponents can be placed. To retain the components within the device,front and back cover assemblies can be placed over the front and backsurfaces of the outer periphery member.

An electronic device enclosure can include several components. In someembodiments, the enclosure can include several elements including angledportions. The elements can be connected to form a closed component(e.g., a loop), such that the component defines an inner volume in whichelectronic device components can be retained. In some embodiments, aninternal structure such as an internal platform can be placed within thecomponent to enhance the structural integrity of the component.

In some embodiments, an electronic device enclosure can include an outerperiphery member having an external side surface, a front surface, aback surface, and an internal surface. An internal platform can beconnected to the internal surface, and placed within a volume enclosedby the outer periphery member (e.g., between the front and back surfacesof the outer periphery member). The internal platform can define firstand second pockets in which electronic device components can beinserted, for example from the front surface or from the back surface ofthe outer periphery member.

In some embodiments, an electronic device enclosure can include an outerperiphery member defining a ring, and within which an internal platformcan be placed. The internal platform can be offset from front and backsurfaces of the outer periphery member. To prevent components placedwithin a volume defined by the outer periphery member from being removedfrom the enclosure, the enclosure can include front and back coverassemblies. The cover assemblies can be placed adjacent to front andback surfaces of the outer periphery member to cover the internalplatform.

In some embodiments, an electronic device enclosure can be constructedby providing an outer periphery member and an internal platform. Theinternal platform can be connected to the outer periphery member suchthat at least a portion of the internal platform is within a height ofthe outer periphery member. Electronic device components can beassembled into the electronic device enclosure from two oppositesurfaces of the internal platform. In some embodiments, one or morecover assemblies can be assembled over the two opposite surfaces of theinternal platform or over two opposite surfaces of the outer peripherymember to retain the electronic device components.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention, its nature andvarious advantages will be more apparent upon consideration of thefollowing detailed description, taken in conjunction with theaccompanying drawings in which:

FIG. 1 is a schematic view of an illustrative electronic device that canbe provided with mechanical and electrical features in accordance withone embodiment of the invention;

FIG. 2A is a cross-sectional view of an illustrative electronic devicestructure taken along the device width in accordance with one embodimentof the invention;

FIG. 2B is an exploded cross-sectional view of an illustrativeelectronic device taken along the device length in accordance with oneembodiment of the invention;

FIG. 2C is a top view of an illustrative electronic device in accordancewith one embodiment of the invention;

FIGS. 2D-2E are bottom views of embodiments of an illustrativeelectronic device in accordance with one embodiment of the invention;

FIG. 3A is a schematic perspective view of an illustrative electronicdevice in accordance with one embodiment of the invention;

FIG. 3B is an exploded view of the electronic device of FIG. 3A inaccordance with one embodiment of the invention;

FIG. 3C is a cross-sectional view of the electronic device of FIG. 3A inaccordance with one embodiment of the invention;

FIG. 4A is a schematic view of an illustrative internal platform coupledto an outer periphery member in accordance with one embodiment of theinvention;

FIG. 4B is a top view of an illustrative internal platform coupled to anouter periphery member in accordance with one embodiment of theinvention;

FIG. 4C is a cross-sectional view of an illustrative internal platformassembled to an outer periphery member in accordance with one embodimentof the invention;

FIG. 5 is a cross-sectional view of an illustrative electronic deviceassembly in accordance with one embodiment of the invention;

FIG. 6 is a cross-sectional view of an illustrative electronic deviceassembly in accordance with one embodiment of the invention; and

FIG. 7 is a flowchart of an illustrative process for assembling anelectronic device in accordance with one embodiment of the invention.

DETAILED DESCRIPTION

An electronic device can be provided with mechanical and electricalcomponents for providing different functionality to a user. In somecases, components of an electronic device can be constructed to providemechanical features that improve the performance, aesthetics, robustnessand size of the electronic device.

Electronic devices that may be provided with these components caninclude desktop computers, computer monitors, computer monitorscontaining embedded computers, wireless computer cards, wirelessadapters, televisions, set-top boxes, gaming consoles, routers, portableelectronic devices such as laptop computers, tablet computers, andhandheld devices such as cellular telephones and media players, andsmall devices such as wrist-watch devices, pendant devices, headphoneand earpiece devices, and other wearable and miniature devices. Portabledevices such as cellular telephones, media players, and other handheldelectronic devices are sometimes described herein as an example.

An illustrative electronic device that can be provided with mechanicaland electrical features to improve performance, aesthetics, robustness,and size is shown in FIG. 1 . As shown in FIG. 1 , device 10 can includestorage and processing circuitry 12. Storage and processing circuitry 12can include one or more different types of storage such as hard diskdrive storage, nonvolatile memory (e.g., flash memory or otherelectrically-programmable-read-only memory), volatile memory (e.g.,static or dynamic random-access-memory), or combinations of these.Storage and processing circuitry 12 may be used in controlling theoperation of device 10. Processing circuitry in circuitry 12 can bebased on processors such as microprocessors, microcontrollers, digitalsignal processors, dedicated processing circuits, power managementcircuits, audio and video chips, and other suitable integrated circuits.

With one suitable arrangement, storage and processing circuitry 12 canbe used to run software on device 10, such as internet browsingapplications, voice-over-internet-protocol (VOIP) telephone callapplications, email applications, media playback applications, operatingsystem functions, antenna and wireless circuit control functions, orcombinations of these. Storage and processing circuitry 12 can be usedin implementing suitable communications protocols. Communicationsprotocols that may be implemented using storage and processing circuitry12 can include internet protocols, wireless local area network protocols(e.g., IEEE 802.11 protocols—sometimes referred to as Wi-Fi®), protocolsfor other short-range wireless communications links such as theBluetooth® protocol, protocols for handling cellular telephonecommunications services, or other such communications protocols.

Input-output devices 14 may be used to allow data to be supplied todevice 10 and to allow data to be provided from device 10 to externaldevices. Examples of input-output devices 14 that may be used in device10 include display screens such as touch screens (e.g., liquid crystaldisplays or organic light-emitting diode displays), buttons, joysticks,click wheels, scrolling wheels, touch pads, key pads, keyboards,microphones, speakers and other devices for creating sound, cameras,sensors, or combinations of these. A user can control the operation ofdevice 10 by supplying commands through devices 14 or by supplyingcommands to device 10 through an accessory that communicates with device10 through a wireless or wired communications link. Devices 14 oraccessories that are in communication with device 10 through a wired orwireless connection may be used to convey visual or sonic information tothe user of device 10. Device 10 may include connectors for forming dataports (e.g., for attaching external equipment such as computers,accessories, etc.).

The various components of the electronic device may be surrounded byhousing 16. The housing can protect the internal components and may helpkeep the internal components in their assembled position within device10. Housing 16 may also help form part of the outer peripheral look andfeel of device 10, (e.g., the ornamental appearance). The housing can bewidely varied. For example, the housing can include a variety ofexternal components that utilize a variety of different materials. Inone example, at least a portion of the housing can include atranslucent/transparent portion through which internal components mayoptically communicate to the outside world.

In accordance with one embodiment, device 10 can include optical system18. Optical system 18 can include, for example, optical components thatwork through window or opening 22 in the housing 16. The opticalcomponents can, for example, correspond to one or more camera modules.Although situated inside the housing 16, the camera modules may beconfigured to capture image data outside the device 10 via window 22 bya line of sight that passes through window 22. The optical componentscan be oriented along axis 24, where the axis is aligned with window 22to provide the best possible image capture. By way of example, window 22may be associated with a translucent or transparent portion of thehousing. In one embodiment, the device 10 can include one or morealignment structures for ensuring proper mounting and operation ofoptical system 18 relative to the housing 16.

A housing member of an electronic device can provide a variety ofattributes to the electronic device including, for example, structuralattributes, functional attributes, cosmetic attributes, or combinationsof these. In some cases, a housing member can form an external componentof the electronic device, and therefore provide the mechanical structurefor the device. A housing member can be provided in any suitable form.In some embodiments, the housing member can include an outer peripherymember. FIG. 2A is a cross-sectional view of an illustrative electronicdevice structure having an outer periphery member taken along the devicewidth in accordance with one embodiment of the invention. FIG. 2B is anexploded cross-sectional view of an illustrative electronic devicehaving an outer periphery member taken along the device length inaccordance with one embodiment of the invention. FIG. 2C is a top viewof an illustrative electronic device having an outer periphery member inaccordance with one embodiment of the invention. FIGS. 2D and 2E arebottom views of various embodiments of an illustrative electronic devicehaving an outer periphery member in accordance with one embodiment ofthe invention. Electronic device 200 can include any suitable type ofelectronic device, including for example one or more of the types ofelectronic devices described above in connection with device 10 (FIG. 1).

Electronic device 200 can have any suitable shape, including for examplea shape delimited by front surface 210, back surface 212, left surface214, right surface 216, top surface 218 and bottom surface 219 (notshown in the cross-sections of FIGS. 2A and 2B). Each surface can besubstantially planar, curved, or combinations of these. The surfaces caninclude one or more chamfers, detents, openings, dips, extensions, orother features modifying the smoothness of the surfaces.

Electronic device 200 can be constructed using any suitable structure,including for example using outer periphery member 220. Outer peripherymember 220 can form a loop that surrounds or wraps around some or all ofthe electronic device. The loop formed by outer periphery member 220 candefine internal volume 222 into which electronic device components canbe placed. For example, outer periphery member 220 can wrap around thedevice such that the external surfaces of outer periphery member 220define some or all of left surface 214, right surface 216, top surface218 and bottom surface 219 of the device. To provide a desiredfunctionality to a user, the electronic device can include severalcomponents placed within the device, for example within volume 222.

The outer periphery member can have a particular height (e.g., thedevice height h) that serves to define an amount of volume 222. Inparticular, volume 222, or individual measurable quantities of outerperiphery member 220 (e.g., height, thickness, length, or width) can beselected to provide at least a minimum volume amount required forreceiving and securing electronic device components. In someembodiments, other criteria can instead or in addition drive themeasurable quantities of outer periphery member 220. For example, thethickness (e.g., outer periphery member thickness t), length (e.g.,device length l), height (e.g., device height h), and cross-section ofthe outer periphery member can be selected based on structuralrequirements (e.g., stiffness, or resistance to bending, compression,tension or torsion in particular orientations). As another example, themeasurable quantities of outer periphery member 220 can be selectedbased on a desired device size or shape, for example driven byindustrial design considerations.

In some embodiments, the outer periphery member can serve as astructural member to which other electronic device components can bemounted. In particular, it may be desirable to secure individualelectronic device components placed within the device to ensure that thecomponents do not move and break, which could adversely affect thefunctionality of the device. Outer periphery member 220 can include anysuitable feature for securing a device component. For example, the outerperiphery member can include one or more depressions, recesses,channels, protrusions, or openings for receiving or engaging electronicdevice components. In some embodiments, the outer periphery member caninstead or in addition include features for retaining internalstructural device components to which other components can be secured.For example, an internal structure such as an internal platform(described below in more detail) can be coupled to an internal surfaceof the outer periphery member, such that other electrical components canbe mounted to the internal platform. In some embodiments, the outerperiphery member can include one or more openings to provide access toone or more internal components retained within volume 222.

Outer periphery member 220 (or device 200) can have any suitablecross-section. For example, outer periphery member 220 can have asubstantially rectangular cross-section. In some embodiments, outerperiphery member 220 can instead or in addition have a cross-section ina different shape, including for example a circular, oval, polygonal, orcurved cross-section. In some embodiments, the shape or size of thecross-section can vary along the length or width of the device (e.g., anhourglass shaped cross-section).

Outer periphery member 220 can be constructed using any suitableapproach. In some embodiments, outer periphery member 220 can beconstructed by connecting several distinct elements together. Forexample, outer periphery member 220 can be constructed by connectingthree distinct elements together (e.g. 424, 426 and 428). The elementscan be formed from any suitable material, including for example a metal.In particular, the elements can be included in one or more electricalcircuits (e.g., as part of an antenna assembly, or as a heart-ratemonitor). The individual elements can be formed using any suitableapproach. In some embodiments, an element can be formed using cold work.In some embodiments, an element can instead or in addition be formedusing a forging process, an annealing process, a machining process, orany other suitable process or combination of processes. In someembodiments, individual elements can be connected to each other or toother electronic device components using a braising process (e.g., toconnect a ceramic material to an individual component serving as part ofan antenna). It should be appreciated that the gaps or breaks betweeneach adjacent element 424, 426 and 428 may be smaller than shown inFIGS. 2E and/or 4B, which emphasize the breaks for clarity.

The individual elements of the outer periphery member can be connectedtogether using any suitable approach. In some embodiments, a fastener oradhesive can be used to connect the individual elements. In someembodiments, intermediate elements 430 can instead or in addition beplaced between adjacent individual elements to securely connect theindividual elements together. For example, an intermediate element 430can be formed from a material that can change from a first state to asecond state. In the first state, the material of the intermediateelement 430 can flow in a gap between adjacent individual elements. Inthe second state, the material can adhere to the adjacent individualelements, and provide a structural bond between the individual elementssuch that the individual elements and the intermediate element 430 forman integral component. For example, the intermediate element 430 can beconstructed from a plastic material.

In some embodiments, the individual elements can be formed from aconductive material, while the intermediate elements 430 can be formedfrom an insulating or dielectric material. This can ensure thatdifferent electrical circuits that include individual elements do notinterfere with one another. In addition, the dielectric material in gapsbetween individual elements can help control capacitance, radiofrequency energy, and other electrical transfers across the gaps.

Connecting individual elements together using an intermediate element430 can create artifacts or other imperfections along the interfacesbetween the individual elements and the intermediate element 430. Forexample, excess material of the intermediate element 430 can flash orspill beyond a boundary of the interface, and onto an external surfaceof one of the individual elements. To ensure that the resultingcomponent is aesthetically pleasing and satisfies industrial designrequirements, the component can be processed to remove excess materialfrom one or more of the individual elements and the intermediateelement. For example, a single process or tool can be used to finish thedifferent elements. The single process can be applied at a singlesetting including, for example, a setting corresponding to the softestmaterial of the individual elements and intermediate element used toform the component. In some cases, the process can instead or inaddition dynamically adjust the manner in which the process is appliedbased on the material or element being processed. For example, theforce, speed or tool type used can vary based on the element beingprocessed. The resulting component can include a continuous surfaceacross an interface between an individual element and an intermediateelement. For example, the resulting component can include a smoothsurface across a seam between two elements.

Electronic device components can be placed within volume 222 using anysuitable approach. For example, electronic device 200 can includecomponents 230 and 232 inserted into volume 222. Each of components 230and 232 can include individual components, or several componentsassembled together as a component layer or stack, or include severaldistinct layers of components to insert within volume 222. In someembodiments, components 230 and 232 can each represent severalcomponents stacked along the height of the device. The component layerscan be electrically coupled to each other to enable data and powertransfers, as required for the proper operation of electronic device200. For example, the component layers can be electrically coupled usingone or more of a PCB, flex, solder, SMT, wires, connectors, orcombinations of these. The component layers can be inserted into outerperiphery member 220 using any suitable approach. For example,components 230 and 232 can all be inserted from front surface 210 orfrom back surface 212 (e.g., back to front, front to back, or middle tofront and back). Alternatively, the components can be inserted from bothfront surface 210 and back surface 212.

In some embodiments, one or more of the components can serve as astructural element. Alternatively, electronic device 200 can include adistinct structural element placed within volume 222 and coupled toouter periphery member 220. For example, electronic device 200 caninclude one or more internal members or platforms 240, which can serveas a mounting points or regions for helping secure, hold or pack one ormore component layers (e.g., attaching component 230 to the back surfaceof internal platform 240, and component 232 to the front surface ofinternal platform 240). Internal platform 240 can be coupled to outerperiphery member 220 using any suitable approach, including for exampleusing snaps, fasteners, flexures, welds, glue, or combinations of these.Alternatively, internal platform 240 may even be part of the outerperiphery member (e.g., machined, extruded, or cast, or integrallyformed as a single unit). The internal platform can have any suitablesize, including for example a size that is smaller than the internalvolume of outer periphery member 220.

Internal platform 240 can be positioned at any suitable height withinouter periphery member 220, including for example substantially at halfthe height of outer periphery member 220. The resulting structure (e.g.,outer periphery member 220 and internal platform 240) can form anH-shaped structure that provides sufficient stiffness and resistance totension, compression, torsion and bending.

The internal platform, inner surfaces of the outer periphery members, orboth can include one or more protrusions, depressions, shelves,recesses, channels, or other features for receiving or retainingelectronic device components. In some cases, the internal platform,outer periphery member or both can include one or more openings forcoupling components located in the front and back regions of internalplatform 240. The size of each region can be selected based on anysuitable criteria, including for example operational needs of system,numbers and types of electrical components in the device, manufacturingconstraints of the internal platform, or combinations of these. Theinternal platform can be constructed as a distinct component from anysuitable material (e.g., plastic, metal or both), or instead definedfrom an existing electronic device component placed within the volumedefined by the outer periphery member. For example, the internalplatform can be formed by a printed circuit board or chip used by thedevice.

In some embodiments, internal platform 240 can include one or moreelectrically conductive elements for providing electrical connectionsbetween the components. For example, internal platform 240 can includeone or more PCB, flex, wire, solder pad, cable, connector, or otherelectrically conductive mechanism for connecting components within thedevice.

Electronic device 200 can include front cover assembly 250 and backcover assembly 260 defining the front and back surfaces, respectively,of device 200. The front and back cover assemblies can include one ormore components, or can include at least a front member and a backmember that form some or all of the outer front and back surfaces of thedevice. Front and back cover assemblies 250 and 260 can be flush,recessed or protruding relative to the front and back surfaces of outerperiphery member 220. In the example of FIGS. 2A and 2B, front coverassembly 250 and back cover assembly 260 can be proud or protrude abovefront and back edges of outer periphery member 220 (e.g., such than aninterior surface of the cover assemblies is flush with a front or backsurface of the outer periphery member).

Alternatively, one or both of the cover assemblies can be flush or subflush relative to the outer periphery member, for example to preventedges from engaging other surfaces (e.g., at least a portion of thecover assemblies can be included within volume 222). In someembodiments, one or both of front cover assembly 250 and back coverassembly 260 can include one or more windows. Any suitable informationor content can pass through the windows. For example, a cover assemblycan include a window through which a camera can capture images. Asanother example, a cover assembly can include a window through whichcontent provided by a display may be made available, or through whichlight (e.g., from a flash) can be provided.

In some embodiments, different components of the electronic device canbe substantially made of glass. For example, portions of the electronicdevice housing can have at least 75% of its exterior as glass. In oneimplementation, one or both of the cover assemblies can include a glasselement providing a substantial portion of the cover assembly. Inparticular, the front and back surfaces of the device can includesubstantial amounts of glass, while left, right, top and bottom surfacesof the device can include substantial amounts of a metal (e.g., steel).

In some embodiments, the housing of a portable electronic device can bebanged or rub against various surfaces. When plastic or softer metalhousing surfaces are used, the surfaces can tend to become scratched. Onthe other hand, glass housing surfaces (e.g., glass cover assemblies)can be more scratch resistant. Moreover, glass housing surfaces canoffer radio transparency, while metal housing surfaces can disturb orhinder radio communications. In one embodiment, an electronic devicehousing can use glass housing members (e.g., glass cover assemblies) fora front surface and a back surface of the electronic device housing. Forexample, a front surface formed from a glass housing member can betransparent to provide visual access to a display device positionedbehind the glass housing member at the front surface, while a backsurface formed from a glass housing member can be transparent ornon-transparent. Non-transparency, if desired, can conceal any interiorcomponents within the electronic device housing. In one embodiment, asurface coating or film can be applied to the glass housing member toprovide non-transparency or at least partial translucency. Such asurface coating or film can be provided on an inner surface or an outersurface of the glass housing member.

FIG. 3A is a schematic perspective view of an illustrative electronicdevice in accordance with one embodiment of the invention. FIG. 3B is anexploded view of the electronic device of FIG. 3A in accordance with oneembodiment of the invention. FIG. 3C is a cross-sectional view of theelectronic device of FIG. 3A in accordance with one embodiment of theinvention. The electronic device of FIGS. 3A-3C can include some or allof the features of the electronic device of FIGS. 2A-2D. In particular,components having similar numbers can share some or all features. Outerperiphery member 320 can surround the periphery of electronic device 300to form some or all of the outer-most side, top and bottom surfaces(e.g., front surface 310, back surface 312, left surface 314, rightsurface 316, top surface 318 and bottom surface 319) of the electronicdevice. Outer periphery member 320 can have any suitable shape,including for example one or more elements that can be combined to forma ring. The ring-shape of outer periphery member 320 can enclose volume322 in which electronic device components can be assembled and retained.The shape of outer periphery member 320 can define the boundaries ofvolume 322, and therefore can be determined based on the size and typeof components placed within volume 322. The boundaries of volume 322(e.g., determined by the shape of outer periphery member 320) can haveany suitable shape, including for example a substantially rectangularshape (e.g., having straight or rounded edges or corners), a circularshape, an oval shape, a polygonal shape, or any other closed shape thatcan define a volume.

Outer periphery member 320 can have any suitable size, which can bedetermined based on any suitable criteria (e.g., aesthetics orindustrial design, structural considerations, components requires for adesired functionality, or product design). For example, outer peripherymember 320 can have a length (e.g., along axis 101) in the range of 70mm to 150 mm, such as 80 mm to 140 mm, 90 mm to 130 mm, 100 mm to 120mm, or 105 mm to 115 mm, or any other sub-range within the range of 70mm to 150 mm. As another example, outer periphery member 320 can have awidth (e.g., along axis 102) in the range of 40 mm to 85 mm, such as 50mm to 75 mm, 55 mm to 65 mm, or any other sub-range within the range of40 mm to 85 mm. As still another example, outer periphery member 320 canhave a height (e.g., along axis 103) in the range of 4 mm to 15 mm, suchas 5 mm to 14 mm, 6 mm to 13 mm, 7 mm to 12 mm, 8 mm to 11 mm, 9 mm to10 mm, or any other sub-range within the range of 4 mm to 15 mm.

The outer periphery member can have any suitable cross-section,including for example a variable cross-section or a constantcross-section. In some embodiments, the cross-section of the ring can beselected based on desired structural properties for the outer peripherymember. For example, the cross-section of outer periphery member 320 canbe substantially rectangular, such that the height of the outerperiphery member is substantially larger than the width of the outerperiphery member. This can provide structural stiffness in compressionand tension, as well as bending. In some embodiments, the dimensions ofthe outer periphery member cross-section can be determined relative tothe dimensions of the internal platform cross section. For example, theouter periphery member height can be in a range of 5 to 15 times theheight of the internal platform, for example 8 to 12 times, 9 to 11times, or approximately 10 times the height of the internal platform. Inone implementation, the height of the outer periphery member can beapproximately 9 mm, and the height of the internal platform can beapproximately 0.9 mm.

As another example, the width of the outer periphery member can be in arange of 8 to 25 times the width of the internal platform, for example12 to 20 times, 15 to 18 times, or approximately 16 times the internalplatform width. For example, the width of the outer periphery member canbe 3 mm and the width of the internal member can be 50 mm. In someembodiments, the height of the internal platform can be related to thewidth of the outer periphery member. For example, the width of the outerperiphery member can be 1 to 8 times the height of the internalplatform, such as 2 to 6 times or approximately 4 times the height ofthe internal platform. In one implementation, the height of the internalplatform can be approximately 0.7 mm and the width of the outerperiphery member can be approximately 2.5 mm. In some embodiments, theheight of the outer periphery member can be related to the width of theinternal platform. For example, the width of the internal platform canbe 3 to 10 times the height of the outer periphery member, such as 4 to8 times, 5 to 7 times, or approximately 6 times the height of the outerperiphery member. For example, the width of the internal platform can beapproximately 5.5 mm and the height of the outer periphery member can beapproximately 0.9 mm.

In some embodiments, outer periphery member 320 can include one or moreopenings, knobs, extensions, flanges, chamfers, or other features forreceiving components or elements of the device. The features of theouter periphery member can extend from any surface of the outerperiphery member, including for example from internal surfaces (e.g., toretain internal components or component layers), or from externalsurfaces. In particular, outer periphery member 320 can include a slotor opening 324 for receiving a card or tray within the device. Opening324 can be aligned with one or more internal components operative toreceive and connect to an inserted component (e.g., an inserted SIMcard). As another example, outer periphery member 320 can includeconnector opening 325 (e.g., for a 30-pin connector) through which aconnector can engage one or more conductive pins of electronic device300. Outer periphery member 320 can include openings 326 and 327 forproviding audio to a user (e.g., an opening adjacent to a speaker), orreceiving audio from a user (e.g., an opening adjacent to a microphone).Outer periphery member 320 can instead or in addition include an openingfor an audio connector or power supply (e.g., opening 328), or features329 for retaining and enabling a button such as a volume control orsilencing switch.

The various features of outer periphery member 320 can be constructedusing any suitable approach and at any suitable time. In someembodiments, the features can be constructed as part of a process thatcreates outer periphery member 320 from a single piece of material thatis manufactured into the final shape of outer periphery member 320(e.g., using a machining process). In some embodiments, several piecesof material can instead or in addition be shaped individually andcombined into outer periphery member 320. For example, several angledelements (e.g., two elements with sections having substantially 90degree angles, and one element with two sections each having a 90 degreeangle) can be connected together to form a closed component (e.g., aloop). The various features can then be created as part of eachindividual piece, or once the entire outer periphery member has beenassembled. Outer periphery member 320 can be constructed from anysuitable material, including for example a metal (e.g., steel oraluminum), plastic (e.g. polyurethane, polyethylene or polycarbonate),composite material, or any combination thereof. In some embodiments,outer periphery member 320 can be constructed from the combination ofseveral materials.

In some embodiments, outer periphery member 320 can have a functionaluse or purpose in addition to serving as a cosmetic component or as astructural component. For example, outer periphery member 320 can beused as part of an antenna for capturing electromagnetic waves radiatedby or in a communications network. In some cases, outer periphery member320 can be used as parts of more than one antenna.

In some embodiments, one or more portions of outer periphery member 320can be treated to provide an aesthetically pleasing component. Inparticular, left surface 314, right surface 316, top surface 318, andbottom surface 319 can be treated using a cosmetic surface treatmentsuch as, for example, polishing, coating (e.g., using a dye or coloringmaterial, or a material providing an optical effect), glazing, thin filmdeposition, grinding, superfinishing, or any other suitable process. Insome embodiments, front or back surfaces of outer periphery member 320can instead or in addition be provided with a cosmetic treatment (e.g.,for regions of the outer periphery member that may not be covered byback and front cover assemblies 350 and 360).

To reduce the overall weight, size or both of electronic device 300, thethickness of outer periphery member 320 can be selected such that outerperiphery member 320 is only minimally resistant to one or more ofbending, torsion, tension, compression, or other deformation of theband. For example, outer periphery member 320 can be more resistant totension and compression, but less resistant to bending or torsion. Toprovide sufficient resistance to all types of deformation, electronicdevice 300 can include a structural component placed within volume 322.In some embodiments, one or more of the internal components of theelectronic device can be connected to the outer periphery member andserve as a structural component. For example, a circuit board (with orwithout a separate stiffening element) can be connected to oppositeportions of outer periphery member 320. Alternatively, a distinct anddedicated structural component can be coupled to outer periphery member320. In the example of FIGS. 3A-3C, electronic device 300 can includeinternal platform 340 forming a distinct structural component of theelectronic device. Internal platform 340 can include any suitable shape,including for example a substantially planar shape. In some embodiments,internal platform 340 can include several distinct regions, such as aprimary region and step regions extending from the primary region toengage one or more features of outer periphery member 320. An internalplatform such as internal platform 340 is described in more detail inconnection with FIGS. 4A-4B.

FIG. 4A is a schematic view of an illustrative internal platform coupledto an outer periphery member in accordance with one embodiment of theinvention. FIG. 4B is a top view of an illustrative internal platformcoupled to an outer periphery member in accordance with one embodimentof the invention. FIG. 4C is a cross-sectional view of an illustrativeinternal platform coupled to an outer periphery member in accordancewith one embodiment of the invention. Device housing 400 can includeouter periphery member 420 to which internal platform 440 is coupled.The outer periphery member and internal platform can include some or allof the features described above with respect to the devices of FIGS.2A-2E and 3A-3C. In particular, internal platform 440 can include someor all of the features described above in connection with internalplatform 340.

Internal platform 440 can be constructed using any suitable approach. Insome embodiments, internal platform 440 can be constructed from a singleelement or as a combination of several elements. Internal platform 440can be placed within an electronic device to support or retainelectrical components. Internal platform 440 can include severaldistinct conductive plates (e.g., metal plates), including base plate441, top step 442, and bottom step 444. The plate and steps can have anysuitable size including, for example, a large plate cover a substantialportion of the area enclosed by an outer periphery member (e.g., 40%,50%, 60%, 70%, 80% or 90%). Alternatively, the entire internal platform440 can cover only a portion of the area enclosed by an outer peripherymember (e.g., 60%, 70%, 80%, 90%, or more). The steps can besubstantially smaller than the plate including, for example, serving astabs to ground portions of internal platform 440.

Each of the plates and steps can be constructed from the same ordifferent material including, for example, from a same conductivematerial (e.g., from a metal). In some embodiments, one or more of thesteps can be incorporated in the same piece of material used to form theplate. For example, step 444 can include a stepped-up region of plate441. Alternatively, a step can be constructed from a different piece ofmaterial than the plate. For example, step 442 can be constructed from adifferent piece of material that plate 441. Plate 441 and steps 442 and444 can be placed in the same or different planes. In oneimplementation, base plate 441 can be placed at a first level, whilesteps 442 and 444 can be offset relative to base plate 441 (e.g.,stepped up towards the front surface of the device). Steps 442 and 444can be stepped by any suitable amount including, for example, asubstantially identical amount (e.g., such that steps 442 and 444 aresubstantially in the same plane). For example, steps 442 and 444 can bepositioned such that the front surfaces of the step are flush orslightly sub flush relative to a front surface of outer periphery member420, to which the steps are connected. Breaks in internal platform 440for distinguishing between plate 441 and steps 442 and 444 can beprovided at any suitable position. For example, the breaks can belocated as part of the stepped up surface, as the step, or on the plate.In some embodiments, the distinction between a plate and step can bearbitrary because the step and plate are constructed from a single pieceof material.

Plate 441 and steps 442 and 444 can be at least partially electricallyisolated to ensure that elements of an outer periphery member remainelectrically isolated (e.g., to guarantee antenna performance). Forexample, step 442 can be connected to plate 441, or to a stepped upportion of plate 441 using connecting element 450. Connecting element450 can be constructed from any suitable material, including for examplea suitable insulating material (e.g., plastic injection molded betweenstep 442 and plate 441). As another example, step 444 can beincorporated as part of the piece of material used to form plate 441,and can therefore be electrically connected to the plate. Step 444 caninclude connecting element 452 placed on a front surface of the step,for example mirroring connecting element 450. In particular, connectingelements 450 and 452 can be positioned to extend forward from a frontsurface of outer periphery member 420. Connecting elements 450 and 452can be provided using any suitable approach, including for example bymolding material (e.g., plastic) between the plate and the steps, or ona surface of one or more of the plate and steps. Connecting elements 450and 452 can have any suitable shape including, for example, a planarshape or a three-dimensional shape (e.g., including a step to connectplate 441 to one or more of steps 442 and 444 positioned in differentplanes). Elements 450 and 452 can form distinct elements, or can insteadbe different portions of a continuous element. In some embodiments,connecting elements 450 and 452 can be connected to the outer peripherymember in a manner that electrically isolates different sections ofplate 441 (e.g., as shown, for example, in FIG. 4B). Alternatively,connecting elements 450 and 452 can be provided in a manner toelectrically insulate different sections of outer periphery member 420(e.g., insulate elements 424 and 426, but only in the vicinity of step444, as required for antenna performance).

Internal platform 440 can be coupled to outer periphery member 420 usingany suitable approach. In some embodiments, portions of plate 441 andsteps 442 and 444 can extend beyond the edges of connecting elements 450and 452 so that the internal platform can be coupled to the outerperiphery member via the plate and steps (e.g., the metal elements ofthe internal platform can be coupled to the metal outer periphery memberfor grounding or antenna performance). For example, exposed metalsurfaces of plate 441 and steps 442 and 444 can be coupled to outerperiphery member 420 using welding, soldering, or any other connectionprocess that maintains conductivity. Alternatively, one or more of heatstaking, an adhesive, tape, a fastener, or other non-conductiveconnection processes can be used. When a conductive process is used,such as welds 460 (e.g., laser welds), the welds can be distributed suchthat the outer periphery member elements that are to remain electricallyisolated remain isolated. In particular, welds 460 along plate 441 canbe positioned such that small L-shaped element 426 is electricallyisolated from large L-shaped element 424 and U-shaped element 428.Alternatively, if it is important for small shaped element 426 and largeshaped element 424 to be electrically insulated only in the vicinity ofthe interface between the elements, welds 460 can be distributed suchthat an electrically conductive path exists between elements 424 and 426through plate 441, and not through step 444.

Internal platform 440 can be coupled to any suitable portion of outerperiphery member 420. For example, internal platform 440 can beassembled within the height of outer periphery member 420 (e.g., basedon the position of contact points or regions of the outer peripherymember). The distribution of the contact points can be selected based onstructural considerations including, for example, based on a desiredresistance to torsion, bending, or other mechanical forces. Inparticular, the electronic device can include at least four contactpoints or regions distributed within outer periphery member 420 (e.g.,near corners of the outer periphery member). As another example,internal platform 440 can include contact regions along the straightportions of outer periphery member 420 (e.g., along the edges of plate441). As still another example, stepped regions of internal platform 440(e.g., steps 442 and 444) can be coupled to or near the front or backsurfaces of outer periphery member 420 (e.g., on opposite portions ofthe front or back surfaces) such that portions of steps 442 and 444(e.g., connecting elements 450 and 452) extend beyond a front surface ofouter periphery member 420, while plate 441 does not. In someembodiments, outer periphery member 420 can include one or more tabs orextensions for supporting internal platform 440 (e.g., tabs on which theplatform is soldered or welded). For example, outer periphery member 420can include tabs 422 for supporting internal platform 440 when it isinserted within the outer periphery member.

In some embodiments, internal platform 440 can be placed within theheight of outer periphery member 420 such that components can be placedon both the front and back surfaces of internal platform 440. Forexample, some components can be inserted from a back surface, and somecomponents can be inserted from a front surface. The components can becoupled to an internal platform for security, and can instead or inaddition be electrically connected to each other through an opening inor around a periphery of the internal platform. In some embodiments,some components can first be coupled to back and front cover assembliesplaced over the front and back surfaces of the outer periphery member,respectively, before being inserted in an internal volume enclosed byouter periphery member 420 and coupled to the outer periphery member. Ineffect, by its position, internal platform 440 can define back and frontpockets or regions within the volume in which electronic devicecomponents can be placed. The size of each pocket or region can bedetermined based on any suitable criteria including, for example, thenumber and size of components to place in each region, the requiredposition of internal platform 440 relative to the outer periphery member(e.g., if available positions are limited due to structuralrequirements), or combinations of these. For example, a front pocket canbe used for display circuitry and a touch interface, while a back pocketcan be used for processing circuitry, a battery, connector interfaces,and an input interface.

The components can be coupled to internal platform 440 for security, andcan instead, or in addition, be electrically connected to each otherthrough an opening in internal platform 440. Internal platform 440 caninclude any suitable feature for securing or connecting electronicdevice components, such as one or more snaps, prongs, chamfers, extends,openings, access points, doors, or combinations of these. In some cases,internal platform 440 can include one or more dedicated features forreceiving or securing specific electrical components, such as speakers,microphones, audio jacks, cameras, light sources, chips, or combinationsof these. In addition, internal platform 440 can include one or moreelectronic components, including for example connectors and conductivepaths for electrically connecting to electronic device components, andfor transferring data, power, or both between electronic devicecomponents.

Returning to FIGS. 3A-3C, to retain components within volume 332,electronic device 300 can include back cover assembly 360 and frontcover assembly 350 providing the back and front surfaces of theelectronic device, respectively. Each cover assembly can be coupled toouter periphery member 320 using any suitable approach, including forexample using an adhesive, tape, mechanical fastener, hooks, tabs, orcombinations thereof. In some embodiments, one or both of coverassemblies 350 and 360 can be removable, for example for servicing orreplacing electronic device components (e.g., a battery). In someembodiments, front and back cover assemblies 350 and 360 can includeseveral distinct parts, including for example a fixed part and aremovable part. The inner surfaces of front cover assembly 350 and backcover assembly 360 can include any suitable feature, including forexample one or more ridges, hooks, tabs, extensions, or any combinationthereof for retaining the covers or ensuring proper alignment of thecovers on outer periphery member 320. The features of front and backcover assemblies 350 and 360 can interact with corresponding features ofouter periphery member 320 or other components of the electronic deviceto ensure proper placement of the covers.

Back cover assembly 360 and front cover assembly 350 can be positionedin any suitable manner relative to outer periphery member 320. FIG. 5 isa cross-sectional view of an illustrative electronic device assembly inaccordance with one embodiment of the invention. Electronic device 500can include outer periphery member 520 having some or all of thefeatures of outer periphery member 220 (FIGS. 2A-2E). In particular,outer periphery member 520 can include one or more features forretaining internal components of the device (e.g. component 530). Thefront and back surfaces of electronic device 500 can be provided by inpart by front cover assembly 550 and back cover assembly 560, and inpart by front and back exposed surfaces of outer periphery member 520.In particular, front cover assembly 550 and back cover assembly 560 canbe recessed within outer periphery member 520, for example to protectcomponents of the cover assemblies from damage due to impacts along thefront or back surfaces. Front cover assembly 550 and back cover assembly560 can include some or all of the features of back cover assembly 260and front cover assembly 250 (FIGS. 2A-2E).

Front cover assembly 550 and back cover assembly 560 can be coupled toany suitable portion of outer periphery member 520. In some embodiments,front cover assembly 550 and back cover assembly 560 can be connectedrelative to outer periphery member 520 in the same or different manners.In the example of electronic device 500, both front cover assembly 550and back cover assembly 560 can be recessed within the front and backsurfaces, respectively, of outer periphery member 520. In particular,front cover assembly 550 can cover none or only some of front surface524 of outer periphery member 520 such that both outer periphery member520 and front cover assembly 550 define front surface 510 of electronicdevice 500. Similarly, back cover assembly 560 can cover none or some ofback surface 522 of outer periphery member 520 such that back coverassembly 560 defines some or all of back surface 512 of electronicdevice 500. The resulting height of electronic device 500 can then belimited to the height of outer periphery member 520 (e.g., in contrastto the embodiment described in connection with FIGS. 2A-2E, where theheight of device 200 can be the sum of the heights of back coverassembly 260, outer periphery member 220, and front cover assembly 250).

In some embodiments (not shown), one or both of front cover assembly 550and back cover assembly 560 can partially cover front surface 524 andback surface 522, respectively, such that the entirety of the coverassembly is not recessed relative to outer periphery member 520. In somecases, the cover assembly can include an interior lip such that the lipcan extend into the volume enclosed by outer periphery member 520, whilea stepped up portion of the assembly offset from the lip can extend overa front or back surface of the outer periphery member.

In some embodiments, one or both of the cover assemblies can instead bepartially or entirely recessed within the outer periphery member. FIG. 6is a cross-sectional view of an illustrative electronic device assemblyin accordance with one embodiment of the invention. Electronic device600 can include outer periphery member 620 having some or all of thefeatures of outer periphery member 220 (FIGS. 2A-2E). In particular,outer periphery member 620 can include one or more features forretaining electronic components within the device (e.g. component 630).The front and back surfaces of electronic device 600 can be provided inpart by front cover assembly 650 and back cover assembly 660, which caninclude some or all of the features of front cover assembly 250 and backcover assembly 260 (FIGS. 2A-2E).

In contrast with electronic device 500 (FIG. 5 ), one or both of frontcover assembly 650 and back cover assembly 660 can be placed within theperiphery of outer periphery member 620 (e.g., recessed within the outerperiphery member). In the particular example of FIG. 6 , back coverassembly 660 can be recessed within outer periphery member 620, whilefront cover assembly 650 can be placed over the front surface of outerperiphery member 620 (e.g., be proud). Back cover assembly 660 can besized such that some or all of the back cover assembly can fit withinvolume 621 defined by outer periphery member 620. In particular, backcover assembly 660 can be positioned such that back surface 622 of outerperiphery assembly 620 remains exposed to a user. Any suitable amount ofback cover assembly 660 can be recessed within outer periphery member620. For example, the entirety of back cover assembly 660 can berecessed within outer periphery member 620 such that the back surface ofback cover assembly 660 is flush with or behind back surface 622 ofouter periphery member 620. The resulting height of electronic device600 can then be the sum of the heights of outer periphery member 620 andfront cover assembly 650 (and only the height of the outer peripherymember if both cover assemblies are recessed, as illustrated in FIG. 5). Alternatively, a portion of back cover assembly 660 can extend beyondback surface 622 while remaining within the periphery defined by outerperiphery member 620. In such cases, the amount by which back coverassembly 660 extends beyond back surface 622 can be included in thetotal height of device 600.

Returning to electronic device 300 (FIGS. 3A-3C), front cover assembly350 and back cover assembly 360 can be constructed from any suitablematerial or combination of materials. In some embodiments, each of coverassemblies 350 and 360 can be constructed by combining several distinctelements. For example, one or both cover assemblies can include atransparent or translucent plate (e.g., a rectangular plate of glass).As another example, one or both cover assemblies can include a base orsupport structure constructed from one or more of a metal or plastic(e.g., aluminum) onto which a transparent element can be assembled. Thetransparent element can be assembled using any suitable approach,including for example such that one or more electronic device componentscan be visible through the transparent element (e.g., display circuitryor a flash for image capture). As another example, the transparentelement can be provided to receive signals or detect a user'senvironment through the transparent element (e.g., using sensors or acamera). Alternatively, one or more portions of the transparent elementcan be rendered opaque (e.g., using an ink, or by placing a supportstructure behind the transparent element) such that the transparentelement can primarily serve as a cosmetic component. The differentcomponents of each cover assembly can be assembled using any suitableapproach, including for example using one or more of an adhesive,fastener, tape, interlocking components, overmolding or manufacturingprocess, or any combination of these.

In the example of FIGS. 3A-3C, front cover assembly 350 can includesupport structure 352 on which glass plate 354 is assembled. Supportstructure 352 can include one or more openings, including an openingthrough which display 355 can be provided. In some embodiments, one orboth of support structure 352 and glass plate 354 can include openingsfor device components, such as button opening 356 and receiver opening357, as well as other openings for a camera, flash, or other devicesensors or input interfaces. The size and shape of the openings can beselected using any suitable approach, including for example based on thesize and shape of the device components placed in or underneath theopenings (e.g., opening 356 can determined by the size of the button,while opening 357 can be determine from the size of a receiver, andacoustic considerations for providing sufficient audio to a user).

In some embodiments, glass plate 354 can include a cosmetic finishhiding from view internal components of the electronic device. Forexample, an opaque layer can be applied region 359 surrounding display355 to hide from view the non-display portions of the display circuitry.Because one or more sensors may receive signals through glass plate 354,the opaque layer can be selectively removed, or selected to allowsignals to pass through the glass plate to a sensor behind the plate.For example, glass plate 354 can include regions 359 a and 359 b throughwhich sensors (e.g., a camera, infrared sensor, proximity sensor, orambient light sensor) can receive signals.

In some embodiments, front cover assembly 350 can support or enable oneor more interfaces by which a user can use the electronic device. Forexample, glass plate 354 can support a touch interface (e.g., a touchpad or a touch screen) for controlling electronic device processes andoperations. As another example, front cover assembly 350 can include oneor more buttons or sensors (described above) for interacting with thedevice. In some cases, buttons, switches or other interface elements canbe instead or in addition incorporated in outer periphery member 320 orback cover assembly 360. Electronic device 300 can include any othersuitable interface for interacting with a user, including for exampledisplay circuitry, a projector, audio output circuitry (e.g., speakersor a an audio port), a haptic interface (e.g., a motor for creatingvibrations, or a power source for providing an electrical stimulus), orcombinations of these.

To enhance the cosmetic or aesthetic appeal of electronic device 300,one or all of outer periphery member 320, front cover assembly 350 andback cover assembly 360 can be finished using an appropriate process.For example, one or more of polishing, coating (e.g., using a dye orcoloring material, or a material providing an optical effect), glazing,thin film deposition, grinding, superfinishing, or any other suitableprocess can be applied to electronic device components. In someembodiments, one or more glass surfaces (e.g., of front cover assembly350 or of back cover assembly 360) can be finished to provide anaesthetically pleasing appearance, for example using one or more masks,coatings (e.g., photochromatic or dichroic coatings), ink layers, orcombinations of these. The particular finishes applied to the glasssurfaces of front cover assembly 350 and back cover assembly 360 can beselected so that front and back surfaces 310 and 312 have similar ordifferent appearances. In some embodiments, a glass surface can betreated to resist wear or impacts (e.g., scratch resistance), oils fromtouching, or any other external force applied to the device.

FIG. 7 is a flowchart of an illustrative process for assembling anelectronic device in accordance with one embodiment of the invention.Process 700 can begin at step 702. At step 704, an outer peripherymember can be provided. For example, a housing component constructed inthe shape of a loop can be provided. The outer periphery member can beconstructed using any suitable approach, including for example byconnecting together several distinct elements using intermediateelements 430. The outer periphery member can be constructed from anysuitable material or combination of materials, including for exampleconductive and insulating materials, where the conductive materials areprovided for elements forming parts of electrical circuits. At step 706,an internal platform can be provided. For example, a component having atleast one planar region can be provided, where the component is sized toat least partially fit within a volume enclosed by the outer peripherymember. The internal platform can be constructed from one or moreelements including, for example, by combining several elements. In someembodiments, different conductive elements can be combined in a mannerthat electrically insulates the conductive elements of the internalplatform.

At step 708, the internal platform can be connected to the outerperiphery member. For example, the internal platform can be insertedinto a volume defined by the outer periphery member, and retained by theouter periphery member. Any suitable approach can be used to retain theinternal platform, including for example a press fit, mechanicalfastener, an adhesive, molding process (e.g., using an intermediatematerial 430), soldering, welding, or combinations of these. In someembodiments, the process used can be selected based on conductiveproperties of the process. In some embodiments, the internal platformcan be connected to the band in a manner that increases the structuralintegrity of the outer periphery member (e.g., improve resistance to aparticular type of force). The internal platform can divide the volumeenclosed by the outer periphery member into two regions or pockets,where each pocket is accessible from an opposite side or surface of theouter periphery member (e.g., from the front or back of the outerperiphery member). At step 710, electronic device components can beinserted into the volume enclosed by the outer periphery member. Forexample, components can be inserted from one or both surfaces of theouter periphery member, into one or both of the pockets defined by theinternal platform. Components can be inserted individually, and laterconnected to each other within the outer periphery member, or caninstead be at least partially connected outside of the pockets, andinserted, as component assemblies, into the outer periphery member.Individual components or component assemblies can be connected to theinternal platform, or can connect to components placed in the otherpocket through the internal platform.

At step 712, cover assemblies can be placed over open surfaces of theouter periphery member. For example, a front cover assembly can beplaced over a front surface of the outer periphery member, and a backcover assembly can be placed over a back surface of the outer peripherymember. The cover assemblies can be connected or coupled to the outerperiphery member using any suitable approach, including for exampleusing one or more hooks, recesses, protrusions, interlocks, mechanicalfasteners, springs, or other retention components. The cover assembliescan serve as external surfaces of the device, such that componentsinserted within the volume of the outer periphery member (e.g., at step710) can be retained and constrained within the device. In someembodiments, one or both of the front and back cover assemblies can bealigned relative to internal components of the device to ensure that aninternal component can operate properly. For example, a window of thecover assembly can be aligned with a sensor, light source, or display ofthe device. Process 700 can then end at step 714.

The previously described embodiments are presented for purposes ofillustration and not of limitation. It is understood that one or morefeatures of an embodiment can be combined with one or more features ofanother embodiment to provide systems and/or methods without deviatingfrom the spirit and scope of the invention.

What is claimed is:
 1. An electronic device enclosure, comprising: anouter periphery member defining a ring and having a front surface and aback surface; an internal platform placed at least in part within theouter periphery member and connected to at least two distinct regions ofthe outer periphery member, the internal platform offset from the frontsurface and the back surface; a front cover assembly placed adjacent tothe front surface and covering the internal platform; and a back coverassembly placed adjacent to the back surface and covering the internalplatform.
 2. The electronic device enclosure of claim 1, wherein theouter periphery member and internal platform combine to providestiffness to the device.
 3. The electronic device enclosure of claim 1,wherein: the internal platform comprises a main plate placed entirelywithin the height of the outer periphery member.
 4. The electronicdevice enclosure of claim 3, wherein: the internal platform comprises atleast one step connected to the outer periphery member, the at least onestep extending from the main plate.
 5. The electronic device enclosureof claim 4, wherein: the front surface substantially defines a singleplane; and the at least one step is connected to the front surface. 6.The electronic device enclosure of claim 1, wherein: the internalplatform separates a first region of the outer periphery member from asecond region of the outer periphery member, the first region accessedfrom the front surface and the second region accessed from the backsurface; and at least one electronic device component is placed in eachof the first and second regions.
 7. The electronic device of claim 6,wherein the at least two regions have substantially the same volume. 8.The electronic device enclosure of claim 1, wherein: the ringsubstantially defines a rectangle.
 9. The electronic device enclosure ofclaim 1, wherein: the outer periphery member comprises at least one of:a port for a connector; an opening for a removable card; and a hole forreceiving a button.
 10. A method for constructing an electronic device,comprising: providing an outer periphery member defining a loop andcomprising two opposite surfaces; providing an internal platformcomprising two opposite surfaces; connecting the internal platform tothe outer periphery member, wherein at least a portion of the internalplatform is within a height of the outer periphery member; assemblingelectrical components to each of the two opposite surfaces of theinternal platform; and coupling cover assemblies to each of the twoopposite surfaces of the outer periphery member.
 11. The method of claim10, wherein: the two opposite surfaces of the internal platform and thetwo opposite surfaces of the outer periphery member are substantiallyco-planar.
 12. The method of claim 10, further comprising: incorporatinga window in one of the cover assemblies.
 13. The method of claim 10,further comprising: connecting the internal platform to at least twodistinct regions of the outer periphery member to provide structuralstiffness.
 14. The method of claim 10, further comprising: formingseveral outer periphery member elements; and constructing the severalouter periphery member elements to form the loop.
 15. The method ofclaim 14, further comprising: forming the outer periphery memberelements from a metal; and constructing the outer periphery memberelements using a molding process.
 16. An electronic device housingcomponent, comprising: a first element having a first angled section andincluding an internal surface and an external surface; a second elementhaving a second angled section and including an internal surface and anexternal surface; and a third element having third and fourth angledsections and including an internal surface and an external surface,wherein: the first, second and third elements are connected together toform a closed component; the internal surfaces of the first, second andthird elements form a substantially continuous internal surface for thecomponent when the first, second and third elements are connectedtogether; the external surfaces of the first, second and third elementsform a substantially continuous external surface for the component whenthe first, second and third elements are connected together; and thecomponent defines an inner volume into which electronic devicecomponents can be received.
 17. The electronic device housing componentof claim 16, further comprising: a first intermediate element connectingthe first element to the second element; a second intermediate elementconnecting the second element to the third element; and a thirdintermediate element connecting the third element to the first element.18. The electronic device housing of claim 16, wherein: the first,second, third and fourth angles are substantially 90 degree angles. 19.The electronic device housing of claim 16, wherein: the substantiallycontinuous internal surface of the component comprises at least onefeature for securing an electronic device component.
 20. The electronicdevice housing of claim 19, wherein: the at least one feature isoperative to receive an internal platform coupled to the componentwithin the inner volume, wherein the internal platform increases thestructural integrity of the component.